CVE-2023-33063
Qualcomm Multiple Chipsets Use-After-Free Vulnerability
Multiple Qualcomm chipsets contain a use-after-free vulnerability due to memory corruption in DSP Services during a remote call from HLOS to DSP. Vendor/Product: Qualcomm Multiple Chipsets. Added to CISA KEV 2023-12-05; required action: Apply remediations or mitigations per vendor instructions or discontinue use of the product if remediation or mitigations are unavailable.