CVE-2024-43047
Qualcomm Multiple Chipsets Use-After-Free Vulnerability
Multiple Qualcomm chipsets contain a use-after-free vulnerability due to memory corruption in DSP Services while maintaining memory maps of HLOS memory. Vendor/Product: Qualcomm Multiple Chipsets . Added to CISA KEV 2024-10-08; required action: Apply remediations or mitigations per vendor instructions or discontinue use of the product if remediation or mitigations are unavailable.