CVE-2026-21385
Qualcomm Multiple Chipsets Memory Corruption Vulnerability
Multiple Qualcomm chipsets contain a memory corruption vulnerability while using alignments for memory allocation. Vendor/Product: Qualcomm Multiple Chipsets. Added to CISA KEV 2026-03-03; required action: Apply mitigations per vendor instructions, follow applicable BOD 22-01 guidance for cloud services, or discontinue use of the product if mitigations are unavailable.